SMD (surface mounted diode), COB (chip on board), MCOB (multiple chips on board), and MCCOB (multiple chips and cups on board) LED packages (assemblies) of one or more LED dies (or chips) that includes wire bond or other type of electrical connections by flip chip bonding, wire bonding, eutectic bonding, or other technologies. They may make up part of a lighting unit with an optical element and thermal, mechanical, and electrical interfaces.